GOLD BOND ENGINEERING MATERIALS LIMITED

GOLD BOND ENGINEERING MATERIALS LIMITED is a Hong Kong, China company.

• Entity NameGOLD BOND ENGINEERING MATERIALS LIMITED
• Chinese Entity Name金邦工程物料有限公司
• CR No.1063221
• CountryChina
• CityHong Kong
• Registration Date29-JUL-2006
• Company StatusDissolved
• Rate3.83